Model Number

GS-S1K-C1/ C2

G-SN-C1 Laser 3D/2D Subsurface Engraving Machine is a new laser processing equipment that
combines laser technology, computer technology and integrates optics, machiney and electronic.
It adopts pulse laser and focuses it inside transparent materials to produce nanometer points of
vaporous burst. Because the points can constitute splendid picture, pattern, and words inside glass
controlled by computer, ordinary transparent materials can be made into grade luxurious art wares.
Our series laser subsurface engraving machine usually fit to glass decoration industry, crystal gift
industry, glass gift industry, glass and Plexiglas signs industry. It can also be used in secondary process
industry of all kinds of bottles and other transparent materials

Specification: 

Laser Medium                    Diode Pump

Cooling system                   Air cooler 

Laser Wavelength               532nm

Engraving frequency            2 KHz

Pulse Width                      7ns

Single Point Power             1.2MJ

Quality of Laser Beam TEMoo、M2<1.5

Resolution                        500 Dpi

Engraving Dimension   

C1: Max                 160mm*160mm*100mm 

C2: Max                 190mm*160mm*100mm

(Divide large scope into several parts for engraving,larger engrave scope can be specially designed )

Max Ellipse        (300mm*250mm)*100mm

Engraving speed   1500 dots/second

Input Power Standard         220V/110V,50HZ             

Power Consumption           0.6KW

Dimension of Mainframe    

C1/ C2:         L760mm*W560mm*H560mm

Weight  C1/ C2: 65 KG